Principal Mixed-Signal Electrical Design Test Engineer

Cambridge, MA 02139

Posted: 05/09/2023 Employment Type: Contract Industry: Engineering Job Number: 240443

Job Description

Principal Mixed-Signal Electrical Design Test Engineer
Contract:  12 – 18 months+
Location:  Cambridge, MA
Clearance:  Active Secret or Top Secret is required

Responsibilities include the design, build, and test of prototype and deployable electronic systems in support of programs managed from the Cambridge, MA office. This position requires the ability to apply sound engineering fundamentals for the execution of sensor/actuator development projects within the Electronics Division. Members of the group support a variety of multi-disciplinary programs lasting an average of 12 to 18 months each. The candidate needs to be a team player, self-directed, and work well in a multidisciplinary environment. Work on-site in the Cambridge office is expected, with opportunities to perform design work from home as programs allow.

Education, Experience, and Skills:
• 10+ years overall experience with mixed-signal electronic design and a BSEE or BSCE degree (MSEE preferred).
• Extensive experience with electronic hardware design and embedded firmware/software development is required. 
• Candidate must be self-motivated and capable of working at a high technical level with minimal supervision. 
• Responsibilities include electrical system architecture design and requirements definition, component selection, trade studies, schematic generation, circuit simulation, layout design and/or oversight, and board-level bring-up and test.
• Experience in all of the following areas of electronic design: miniature low power embedded systems, microcontroller and FPGA board design, sensor integration, wireless communication interfaces, power regulation, battery conditioning and maintenance
• Basic experience with microcontroller software (using C/C++/or assembly), and FPGA firmware (VHDL or Verilog).  Ability to develop code for bring-up tests or simple demos.
• Familiarity with signal and power integrity analysis tools (Hyperlinx, Ansys)
• Experience with miniature electronic packaging and design using bare die or chip-scale packages.  Ability to understand and influence packaging design constraints and requirements for custom designs.
• Applicants selected for this position will be required to obtain and maintain a U.S. Security Clearance. A primary requirement for a security clearance is US citizenship.
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